UDFN8, 2x3 EXTENDED PAD

CASE 517AZ

ISSUE A

DATE 23 MAR 2015

SCALE 2:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25MM FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

A

D

E

B

C

0.10

PIN ONE

REFERENCE

TOP VIEW

SIDE VIEW

BOTTOM VIEW

L

D2

E2

C

C

0.10

C

0.08

A1

SEATING

PLANE

NOTE 3

b

8X

0.10

C

0.05

C

A B

DIM

MIN

MAX

MILLIMETERS

A

0.45

0.55

A1

0.00

0.05

b

0.20

0.30

D

2.00 BSC

D2

1.35

1.45

E

3.00 BSC

E2

1.25

1.35

e

0.50 BSC

L

0.25

0.35

1

4

8

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

PITCH

1.45 3.40

1

DIMENSIONS: MILLIMETERS

1

NOTE 4

0.30

8X

DETAIL A

A3

0.13 REF

A3

A

DETAIL B

L1

DETAIL A

L

ALTERNATE

CONSTRUCTIONS

L

L1

−−−

0.15

e

RECOMMENDED

5

1.56

GENERIC

MARKING DIAGRAM*

XXXXX = Specific Device Code

A

= Assembly Location

WL

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “

G”,

may or may not be present.

XXXXX

AWLYW

G

1

M

M

0.68

C

0.10

8X

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

A1

A3

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

REFERENCE:

DESCRIPTION:

98AON42552E

ON SEMICONDUCTOR STANDARD

UDFN8, 2X3 EXTENDED PAD

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

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