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DRDC3105 Datasheet(PDF) 3 Page - Diodes Incorporated

Part # DRDC3105
Description  INTEGRATED RELAY, INDUCTIVE LOAD DRIVER
PDF  10 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DRDC3105 Datasheet(HTML) 3 Page - Diodes Incorporated

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DRDC3105
Document number: DS35213 Rev. 5 - 2
3 of 10
www.diodes.com
March 2015
© Diodes Incorporated
A Product Line of
Diodes Incorporated
DRDC3105
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Limit
Unit
Supply Voltage
VCC
6.0
V
Input Voltage (Forward)
VIN(FWD)
6.0
V
Input Voltage (Reverse)
VIN(REV)
-0.5
V
Output Sink Continuous Current
IO
500
mA
Repetitive Pulse Zener Energy Limit (Duty Cycle 0.01%)
Ezpk
50
mJ
Thermal Characteristics for DRDC3105F (SOT23) (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
(Note 5)
PD
310
mW
(Note 6)
350
Thermal Resistance, Junction to Ambient
(Note 5)
RθJA
403
°C/W
(Note 6)
357
Thermal Resistance, Junction to Leads
(Note 11)
RθJL
350
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Thermal Characteristics for DRDC3105E6 (SOT26) (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
Linear Derating Factor
(Notes 7 & 9)
PD
0.9
7.2
W
mW/°C
(Notes 7 & 10)
1.1
8.8
(Notes 8 & 10)
1.7
13.6
Thermal Resistance, Junction to Ambient
(Notes 7 & 9)
RθJA
139
°C/W
(Notes 7 & 10)
113
(Notes 8 & 10)
73
Thermal Resistance, Junction to Leads
(Note 11)
RθJL
100
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Notes:
5. For a device mounted on minimum recommended pad layout 1oz weight copper that is on a single-sided FR4 PCB; device is measured under still air
conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted on 15mm X 15mm 1oz copper.
7. Same as Note 5, except the device is mounted on 25mm X 25mm 1oz copper.
8. Same as Note 7, except the device is measured at < 5 seconds.
9. For a device with one active die.
10. For a device with two die running at equal power.
11. Thermal resistance from junction to solder-point (at the end of the “OUT” lead).



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