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EE-SB5VC Datasheet(PDF) 2 Page - List of Unclassifed Manufacturers

Part # EE-SB5VC
Description  Photomicrosensor with 80-mA Switching Capacity that can be Built into Equipment
PDF  6 Pages
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Manufacturer  ETC [List of Unclassifed Manufacturers]
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EE-SB5VC Datasheet(HTML) 2 Page - List of Unclassifed Manufacturers

  EE-SB5VC Datasheet HTML 1Page - List of Unclassifed Manufacturers EE-SB5VC Datasheet HTML 2Page - List of Unclassifed Manufacturers EE-SB5VC Datasheet HTML 3Page - List of Unclassifed Manufacturers EE-SB5VC Datasheet HTML 4Page - List of Unclassifed Manufacturers EE-SB5VC Datasheet HTML 5Page - List of Unclassifed Manufacturers EE-SB5VC Datasheet HTML 6Page - List of Unclassifed Manufacturers  
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EE-SB5M/SB5MC/SB5V/SB5VC/SB5V-E
EE-SB5M/SB5MC/SB5V/SB5VC/SB5V-E
Specifications Table -- continued from previous page
Item
Reflective
EE-SB5M
EE-SB5MC
EE-SB5V(-E)
EE-SB5VC
Control output
At 5 to 24 VDC: 80-mA load current (IC) with a residual voltage of 0.8 V max.
When driving TTL: 40-mA load current (IC) with a residual voltage of 0.4 V max.
Output
configuration
Transistor on output stage
without detecting object
OFF
ON
OFF
ON
Transistor on output stage
with detecting object
ON
OFF
ON
OFF
Response frequency*
50 Hz
Connecting method
EE-1001/1006 Connectors; soldering terminals
Light source
GaAs infrared LED with a peak wavelength of 940 nm
Receiver
Si photo-transistor with a sensing wavelength of 850 nm max.
*The response frequency was measured by detecting the following disks rotating.
Disk
15 mm
15 mm
15 mm
5mm
200 mm
dia.
 CHARACTERISTICS
Ambient temperature
Operating
-25
°Cto55°C (-13°F to 131°F)
Storage
-30
°Cto80°C (-22°F to 176°F)
Ambient humidity
Operating
45% to 85%
y
Storage
35% to 95%
Vibration resistance
Destruction: 20 to 2,000 Hz (with a peak acceleration of 20G’s), 1.5-mm double amplitude for
4 min each in X, Y, and Z directions
Shock resistance
Destruction: 500 m/s2 for 3 times each in X, Y, and Z directions
Soldering heat resistance
260
°±5°C (See Note.) when the portion between the tip of the terminals and the position
1.5 mm from the terminal base is dipped into the solder for 10
±1 seconds
Note: This conforms to MIL-STD-750-2031-1.



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