CPC1465

12

www.ixysic.com

R05

3. Manufacturing Information

3.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our

devices when handled according to the limitations and information in that standard as well as to any limitations set

forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

3.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

3.3 Reflow Profile

Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

3.4 Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to

the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake

cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of

the wash parameters used to clean the board, determination of the bake temperature and duration necessary to

remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying

methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must

not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

Device

Moisture Sensitivity Level (MSL) Classification

CPC1465D

MSL 1

CPC1465M

MSL 3

Device

Max Reflow Cycles

CPC1465D / CPC1465M

260°C

30 seconds

3