MP6539 – 100V, THREE-PHASE, BLDC MOTOR PRE-DRIVER WITH HS & LS INPUTS

MP6539 Rev. 1.01

www.MonolithicPower.com

3

4/20/2018

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2018 MPS. All Rights Reserved.

PACKAGE REFERENCE

TOP VIEW

TOP VIEW

1

CSO

EXPOSED PAD ON

BACKSIDE

CONNECTED TO GND

MP6539

2

3

4

5

6

7

22

21

20

19

18

17

16

BSTA

SHA

GHA

SHC

GHC

GLC

LSS

LSA

LSB

LSC

VREG

LDO

GND

HSC

VIN

8

15

GLB

HSC

GLC

GHC

GHB

SHB

LDO

SHA

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

MP6539

HSA

nSLEEP

GHA

CSO

DT

OCREF

VREG

HSB

LSC

SHC

LSA

LSB

LSS

BSTC

EXPOSED PAD ON

BACKSIDE

CONNECTED TO GND

VIN

BSTA

GND

GLA

BSTB

nFAULT

QFN-28 (4mmx5mm)

TSSOP-28 EP

ABSOLUTE MAXIMUM RATINGS

(1)

Input voltage VREG, GLA/B/C .... -0.3V to 14.5V

LDO ............................................ -0.3V to 14.5V

BSTA/B/C .................................... -0.3V to 120V

GHA/B/C.................... -0.3V to (BST-SH) + 0.3V

GHA/B/C (transient, 2µs) ..................................

..................................... -8V to (BST-SH) + 0.3V

LSS.................................................. -0.3V to 4V

LSS (transient, 2µs) ............................ -1V to 4V

SHA/B/C ......................................... -5V to 110V

SHA/B/C (transient, 2µs)................. -8V to 110V

All other pins to GND .................... -0.3V to 6.5V

(2)

QFN-28 (4mmx5mm) .................................3.1W

TSSOP-28 EP (9.7mmx6.4mm).................3.9W

Storage temperature................ -55°C to +150°C

Junction temperature ............................. +150°C

Lead temperature (solder) ..................... +260°C

Recommended Operating Conditions

(3)

Thermal Resistance

(4)

QFN-28 (4mmx5mm) ............ 40........ 9 .... °C/W

TSSOP-28 EP ....................... 32........ 6.... °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

ambient

thermal resistance θ

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.