LM4908 MDC MWC

Dual 120MW Headphone Amplifier

20075263

Die Layout (A - Step)

DIE/WAFER CHARACTERISTICS

Fabrication Attributes

General Die Information

Physical Die Identification

LM4908A

Bond Pad Opening Size (min)

70µm x 70µm

Die Step

A

Bond Pad Metalization

ALUMINUM

Physical Attributes

Passivation

NITRIDE

Wafer Diameter

150mm

Back Side Metal

BARE BACK

Dise Size (Drawn)

889µm x 622µm

35.0mils x 24.5mils

Back Side Connection

Floating

Thickness

216µm Nominal

Min Pitch

216µm Nominal

Special Assembly Requirements:

Note: Actual die size is rounded to the nearest micron.

Die Bond Pad Coordinate Locations (A - Step)

(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used

SIGNAL NAME

PAD# NUMBER

X/Y COORDINATES

PAD SIZE

XYX

Y

INPUT B+

1

-367

232

70

x

70

INPUT B-

2

-367

15

70

x

70

OUTPUT B

3

-367

-232

70

x

70

VDD

4

35

-232

155

x

70

OUTPUT A

5

367

-232

70

x

70

INPUT A-

6

367

15

70

x

70

INPUT A+

7

367

232

70

x

70

GND

8

68

232

155

x

70

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