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LT4250LIN8 Datasheet(PDF) 7 Page - Linear Technology |
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LT4250LIN8 Datasheet(HTML) 7 Page - Linear Technology |
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7 / 12 page ![]() 7 LT4250L/LT4250H 4250lhf APPLICATIONS INFORMATION Hot Circuit Insertion When circuit boards are inserted into a live – 48V backplane, the bypass capacitors at the input of the board’s power module or switching power supply can draw huge tran- sient currents as they charge up. The transient currents can cause permanent damage to the board’s components and cause glitches on the system power supply. The LT4250 is designed to turn on a board’s supply voltage in a controlled manner, allowing the board to be safely inserted or removed from a live backplane. The chip also provides undervoltage, overvoltage and overcurrent protection while keeping the power module off until its input voltage is stable and within tolerance. Power Supply Ramping The input to the power module on a board is controlled by placing an external N-channel pass transistor (Q1) in the power path (Figure 6a, all waveforms are with respect to the VEE pin of the LT4250). R1 provides current fault detection and R2 prevents high frequency oscillations. Resistors R4, R5 and R6 provide undervoltage and over- voltage sensing. By ramping the gate of Q1 up at a slow rate, the inrush current charging load capacitors C3 and C4 can be limited to a safe value when the board makes connection. Resistor R3 and capacitor C2 act as a feedback network to accurately control the inrush current. The C2 capacitor can be calculated with the following equation: C2 = (45 µA • CL)/IINRUSH where CL is the total load capacitance = C3 + C4 + module input capacitance. Capacitor C1 and resistor R3 prevent Q1 from momen- tarily turning on when the power pins first make contact. Without C1 and R3, capacitor C2 would pull the gate of Q1 up to a voltage roughly equal to VEE • C2/CGS(Q1) before the LT4250 could power up and actively pull the gate low. By placing capacitor C1 in parallel with the gate capacitance of Q1 and isolating them from C2 using resistor R3 the problem is solved. The value of C1 is given by: C VV V CC INMAX TH TH GD 12 = − •+ () C1 ≅ 35 • C2 for VINMAX = 72V where VTH is the MOSFET’s minimum gate threshold and VINMAX is the maximum operating input voltage. R3 should not exceed a value that produces an R3 • C2 time-constant of 150 µs. A 1k value for R3 will ensure this for C2 values up to 150nF. The waveforms are shown in Figure 6b. When the power pins make contact, they bounce several times. While the contacts are bouncing, the LT4250 senses an undervoltage condition and the GATE is immediately pulled low when the power pins are disconnected. Once the power pins stop bouncing, the GATE pin starts to ramp up. When Q1 turns on, the GATE voltage is held constant by the feedback network of R3 and C2. When the DRAIN voltage has finished ramping, the GATE pin then ramps to its final value. Figure 6a. Inrush Control Circuitry + VEE VDD LT4250H PWRGD UV = 38.5V OV = 71V SENSE C1 470nF 25V C3 0.1 µF 100V C4 100 µF 100V C5 100 µF 16V Q1 IRF530 R2 10 Ω 5% R3 1k, 5% C2 15nF 100V R4 549k 1% R5 6.49k 1% R6 10k 1% R1 0.02 Ω 5% 4 3 2 OV –48V RTN –48V RTN (SHORT PIN) – 48V UV 56 8 7 1 GATE DRAIN VICOR VI-J30-CY VOUT + VOUT – VIN + 5V 4250 F06a GATE IN VIN – + * * DIODES INC. SMAT70A 4 3 2 1 Figure 6b. Inrush Control Waveforms INRUSH CURRENT 500mA/DIV GATE –VEE 10V/DIV DRAIN 50V/DIV VEE 50V/DIV 25ms/DIV 4250 F06b CONTACT BOUNCE MODULE TURN-ON MODULE TURN-ON CONTACT BOUNCE |
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