Features

●

Glass passivated chip junctions

●

Ideal for automated placement

●

Ultrafast reverse recovery time

for high efficiency

●

Low profile package

●

High forward surge capability

●

High temperature soldering：

260℃/10 seconds at terminals

●

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

●

Case:

JEDEC DO-214AB molded plastic

body over passivated chip

●

Terminals:

Solder plated, solderable per

J-STD-002B and JESD22-B102D

●

Polarity:

Laser band denotes cathode end

http://www.trr-jx.com

version: 02

ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or

inductive load. For capacitive load, derate current by 20%

US5A THRU US5M

Surface Mount Ultra Fast Rectifiers

Maximum DC Blocking Voltage

Peak Forward Surge Current 8.3 ms Single Half

Sine Wave Superimposed on Rated Load

Maximum Instantaneous Forward Voltage at 5 A

Parameter

Maximum Repetitive Peak Reverse Voltage

Maximum RMS voltage

Operating and Storage Temperature Range

Maximum Average Forward Rectified Current

at T = 100

°C

c

Maximum DC Reverse Current

T = 25

°C

at Rated DC Blocking Voltage

T =125

°C

a

a

V

V

V

5

120

1.3

5

100

50

35

-55 ~ +150

A

A

V

μA

pF

°C

°C/W

T , T

j

stg

Symbols

Units

50

ns

Typical Junction Capacitance

at V =4V, f=1MHz

R

Maximum Reverse Recovery Time

Typical Thermal Resistance

（1）

（2）

50

100

200

400

600

800

1000

35

70

140

280

420

560

700

50

100

200

400

600

800

1000

75

1.65

1.0

.

（2）

（1）Measured with I = 0.5 A, I = 1 A, I = 0.25 A

F

R

rr

P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.

US5A

US5B

US5D

US5G

US5J

US5K

US5M