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BGA150FR

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications

www.bencent.com.cn

Order Code:

BGA150FR

GDT Array

Version: A1 2016-8-12

`

Small Size Design EIA7050 7.0×5.0×1.5mm

s

μ by one-way

Fast Response and Long Service Life

Moisture sensitivity level

：Level 1

High integrated, ultra-compact and slim leadless ceramic

package for surface installation

Electrical Parameter

Communication equipment

Schematic Symbol

Application information

Package (Top View)

Features

Exterior

SMD

Agency Approvals

DC Breakdown Voltage 1)2) 3)

100V/s

>150

V

Impulse Spark-over Voltage3)

At 1kV/

s

μ

for 99 % of measured values

850

V

At 1kV/

s

μ

Typical values of distribution

750

V

Impulse Discharge Voltage 3)

10/700

s

μ

6,000

V

Impulse Discharge Current 3)

Pin1、3、4、6-Pin25 8/20

μs

1,000

A

Pin1346-Pin25 8/20

s

μ

3.5

KA

Arc Voltage3)

At 1A

~10

V

Insulation Resistance3)

DC=100V

≥1

GΩ

Capacitance at 1MHz3)

VDC=0.5V

≤2.0

pF

Weight

~0.27

g

Operating And Storage

Temperature

-40-90

℃

Marking

Without

1) At delivery AQL 0.65 level II ISO 2859

2) In ionized mode

3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 ，Currents through each end-Pin 1、3、4、6 to the ground

Pin (2、5) .

Icon

Description

Compliance with 2011/65/EU

Compliance withIEC61249-2-21:2003

Mean lead free

65

1

2

3

4

6

5

4

3

1

2