22

PRELIMINARY

R00A

IX6610

3.5

Mechanical Dimensions

3.5.1

IX6610T 28-Pin TSSOP

3.5.2

IX6610T 28-Pin TSSOP Tape & Reel

NOTES:

1. JEDEC Outline: MO-153 AET Rev. F

2. Dimension does not include mold flash protrusions or gate burrs. Mold flash protrusions or

gate burrs shall not exceed 0.15 per side.

3. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall

not exceed 0.25 per side.

4. Dimension does not include dambar protrusion. Allowable Dambar protrusion shall be

0.08mm total in excess of this dimension at maximum material condition. Dambar cannot

be located on the lower radius of the foot. Minimum space between protrusion and adjacent

lead is 0.07mm.

5. Package length and width to be determined at datum plane H.

(inches)

mm

DIMENSIONS

0.245 ± 0.055

(0.010 ± 0.002)

See Note 4

9.70 ± 0.10

(0.382 ± 0.004)

See Note 2

0.65 BSC

(0.026 BSC)

PIN 1

PIN 28

1.20 MAX

(0.047 MAX)

0.925 ± 0.125

(0.036 ± 0.005)

0.65

(0.026)

0.45

(0.018)

Recommended PCB Land Pattern

0.15 MAX

(0.006 MAX)

2.70 ± 0.30

(0.106 ± 0.012)

4.96 ± 0.55

(0.195 ± 0.022)

0.60 ± 0.15

(0.024 ± 0.006)

1.00 REF

(0.04 REF)

0.25

(0.01)

0.20 MIN

(0.008 MIN)

GAUGE PLANE

SEATING PLANE

0º-8º

H

5.80

(0.228)

1.50

(0.059)

0.10

(0.004)

0.127 TYP

(0.005 TYP)

3.00

(0.118)

5.50

(0.217)

Dimensions

mm

(inches)

W=16.00 ± 0.3

(0.630 ± 0.012)

B

(0.406)

A

(0.256)

P=8.00 ± 0.1

(0.315 ± 0.004)

2.0 ± 0.1

(0.08 ± 0.004)

4.0 ± 0.1

(0.16 ± 0.004)

1.75 ± 0.1

(0.069 ± 0.004)

7.50 ± 0.10

(0.295 ± 0.004)

6.00

(0.236)

5.00

(0.197)

2.05

(0.081)

0.33 ± 0.03

(0.013 ± 0.001)

K

(0.091)

K

(0.071)

Notes:

1. Cumulative tolerance for 10 sprocket holes: ±0.20mm

2. Pocket position is true position of pocket relative to sprocket holes, not pocket hole

3. Camber not to exceed 1mm per 250mm in either direction

330.2 DIA.

(13.00 DIA.)

Embossment

Embossed Carrier

1.45

(0.057)

3 PL

1.5 MIN

(0.06 MIN)

1.5 +0.1 / -0.0 DIA

(0.059 +0.004 / -0.0 DIA)