S1DLS - S1MLS

Taiwan Semiconductor

2

Version:F1707

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance per diode

46

°C/W

Junction-to-ambient thermal resistance per diode

86

°C/W

Junction-to-case thermal resistance per diode

50

°C/W

Thermal Performance Note: Units mounted on recommended PCB (5mm x 5mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

-

1.3

V

(2)

-

5

µA

-

150

µA

Notes:

1. Pulse test with PW=0.3 ms

2. Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

S1xLS

(Note 1,2)

H

RV

G

SOD-123HE

3,000 / 7" Reel

RQ

SOD-123HE

10,000 / 13" Reel

Notes:

1. "x" defines voltage from 200V (S1DLS) to 1000V (S1MLS)

2. Whole series with green compound (halogen-free)

EXAMPLE P/N

EXAMPLE P/N

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

DESCRIPTION

S1MLSHRVG

S1MLS

H

RV

G

AEC-Q101 qualified

Green compound