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SSM2211SZ Datasheet(PDF) 21 Page - Analog Devices |
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SSM2211SZ Datasheet(HTML) 21 Page - Analog Devices |
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21 / 24 page  Data Sheet SSM2211 Rev. G | Page 21 of 24 LFCSP PCB CONSIDERATIONS The LFCSP is a plastic encapsulated package with a copper lead frame substrate. The LFCSP is a leadless package with solder lands on the bottom surface of the package, instead of conventional formed perimeter leads. A key feature that allows the user to reach the quoted θJA performance is the exposed die attach paddle (DAP) on the bottom surface of the package. When soldered to the PCB, the DAP can provide efficient conduction of heat from the die to the PCB. To achieve optimum package performance, consideration must be given to the PCB pad design for both the solder lands and the DAP. For further information, see the AN-772 Application Note. |
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