DAC8420FSZ datasheet(6/23 Pages) AD

6 / 23 page

DAC8420

Data Sheet

Rev. C | Page 6 of 23

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

VDD to GND

−0.3 V, +18.0 V

VSS to GND

+0.3 V, −18.0 V

VSS to VDD

−0.3 V, +36.0 V

VSS to VVREFLO

−0.3 V, VSS − 2.0 V

VVREFHI to VVREFLO

+2.0 V, VDD − VSS

VVREFHI to VDD

+2.0 V, +33.0 V

IVREFHI, IVREFLO

10 mA

Digital Input Voltage to GND

−0.3 V, VDD + 0.3 V

Output Short-Circuit Duration

Indefinite

Operating Temperature Range

EP, FP, ES, FS, EQ, FQ

–40°C to +85°C

Dice Junction Temperature

150°C

Storage Temperature Range

–65°C to +150°C

Power Dissipation

1000 mW

Lead Temperature

JEDEC Industry Standard

Soldering

J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 4.

Package Type

θJA

θJC

Unit

16-Lead PDIP (N)

701

°C/W

16-Lead CERDIP (Q)

821

°C/W

16-Lead SOIC (RW)

862

°C/W

θJA is specified for worst case mounting conditions, that is, θJA is specified for

device in socket.

θJA is specified for device on board.

ESD CAUTION

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