AP65450

Document number: DS37135 Rev. 3 - 2

11 of 15

www.diodes.com

August 2017

© Diodes Incorporated

AP65450

PC Board Layout

1.

The AP65450 works at 4A load current, heat dissipation is a major concern in layout the PCB. A 2oz Copper in both top and bottom

layer is recommended.

2.

Provide sufficient vias in the thermal exposed pad for heat dissipate to the bottom layer.

3.

Provide sufficient vias in the Output capacitor PGND side to dissipate heat to the bottom layer.

4.

Make the bottom layer under the device as PGND layer for heat dissipation. The PGND layer should be as large as possible to provide

better thermal effect.

5.

Make the Vin capacitors as close to the device as possible.

6.

Make the VREG5 capacitor as close to the device as possible.

7.

The thermal pad of the device should be soldered directly to the PCB exposed copper plane to work as a heatsink. The thermal vias in

the exposed copper plane increase the heat transfer to the bottom layer.

Figure 6 PC Board Layout