PAM2306DYP datasheet(9/12 Pages) DIODES

9 / 12 page

PAM2306D

Document number: DS36394 Rev. 2 - 2

9 of 12

www.diodes.com

December 2014

PAM2306D

A Product Line of

Diodes Incorporated

Application Information (cont.)

PCB Layout Check List

When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the PAM2306D. These items

are also illustrated graphically in Figure 1. Check the following

in your layout:

1. The power traces, consisting of the GND trace, the SW trace and the VIN trace should be kept short, direct and wide.

2. Does the FB pin connect directly to the feedback resistors? The resistive divider R1/R2 must be c onnected between the (+) plate of COUT

and ground.

3. Does the (+) plate of CIN connect to VIN as closely as possible? This capacitor provides the AC current to the internal power MOSFETs.

4. Keep the switching node, SW, away from the sensitive FB node.

5. Keep the (–) plates of CIN and COUT as close as possible.

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Figure 1. PAM2306D Suggested Layout

PAM2306DYP Datasheet(PDF) 9 Page - Diodes Incorporated