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CS8190 Datasheet(PDF) 11 Page - ON Semiconductor

Part # CS8190
Description  Precision Air-Core Tach/Speedo Driver
PDF  12 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS8190 Datasheet(HTML) 11 Page - ON Semiconductor

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CS8190
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11
PACKAGE DIMENSIONS
DIP–16
NF SUFFIX
CASE 648–08
ISSUE R
SO–20L
DWF SUFFIX
CASE 751D–05
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
9
16
K
PLANE
–T–
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
_
_
_
20
1
11
10
B
20X
C
18X
A1
A
SEATING
PLANE
q
E
D
M
0.25
S
A
S
B
T
e
T
B
A
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
MIN
MAX
MILLIMETERS
A
2.35
2.65
A1
0.10
0.25
B
0.35
0.49
C
0.23
0.32
D
12.65
12.95
E
7.40
7.60
e
1.27 BSC
H
10.05
10.55
h
0.25
0.75
L
0.50
0.90
q
0
7
__
PACKAGE THERMAL DATA
Parameter
DIP–16
SO–20L
Unit
RΘJC
Typical
15
9
°C/W
RΘJA
Typical
50
55
°C/W



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