AL5822

Document number: DS41708 Rev. 1 - 2

3 of 10

www.diodes.com

January 2019

© Diodes Incorporated

AL5822

Symbol

Parameters

Ratings

Unit

Clamp Voltage for VIN Pin

30

V

Voltage on VS Pin

-0.3 to 6

V

Voltage on VC Pin

-0.3 to 6

V

Voltage on VLMT Pin

-0.3 to 6

V

Voltage on VG Pin

-0.3 to 20

V

Operating Junction Temperature

-40 to +150

°C

Storage Temperature

-55 to +150

°C

Lead Temperature (Soldering, 10s)

+260

°C

0.41

W

Thermal Resistance (Junction to Ambient, no Heatsink)

240

°C/W

Thermal Resistance (Junction to Case)

60

°C/W

–

ESD (HBM)

±4,000

V

ESD (CDM)

±1,000

V

Note:

4.

Device mounted on 1’’x1’’ FR-4 MRP substrate PC board, 2oz cooper, with minimum recommended pad layout. No thermal via and no ground plane.

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be

affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged

by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices.

Symbol

Parameter

Min

Max

Unit

Operating Ambient Temperature Range

-40

+105

°C

11

V

Note:

5. The device may operate normally at +125°C ambient temperature under the condition not triggers temperature protection.