s Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGD1111C-0301
s Taping Specifications
s Operation Current Derating Chart (DC)
DG, DC, DB,
s Spatial Distribution
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 •
• Tel: 800-LED-LCD1 (533-5231) •
• Fax: 949-222-0555
Website: www.stanley-electric.com
Operation Heating
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
60 to 120 sec.
5 sec. max
0
120
150
240
°C
(0.2)
Center Hole
(0.9)
(φ 0.5)
Center Hole
(1)
4+0.1
φ 1.5 +0.1
0
2+0.05
4+0.1
Direction to pull
Quantity on tape:
4000 pieces
per reel
(Ta=25°C)
Green
DG
76
20
48
5
s Absolute Maximum Ratings
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Symbol
Pd
IF
IFM
VR
Topr
Tstg
∆IF
Blue
DB
76
20
48
5
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C,
IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
0.28 (DC) 0.69 (Pulse)
Units
Item
-40 to +85
-40 to +100
Bluish-Green
DC
76
20
48
5
φ 21+0.8
9+0.3
11.4+1
φ 13+0.2
φ 180
+0
3
2+0.5
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