F2270 Datasheet

© 2019 Integrated Device Technology, Inc.

4

January 16, 2019

Absolut e M a x im um Ra t ings

Stresses above those listed below may cause permanent damage to the device. Functional operation of the device at these or any other

conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

T a ble 2 .

Absolut e M a x im um Ra t ings

Parameter

Symbol

Minimum

Maximum

Units

-0.3

6.0

V

-0.3

Lower of

V

-0.3

Lower of

V

RF1, RF2 to GND

-0.3

0.3

V

RF1 or RF2 Input Power Applied for 24 Hours Maximum

75Ω)

+28

dBm

Junction Temperature

+150

°C

Storage Temperature Range

-65

+150

°C

Lead Temperature (soldering, 10s)

+260

°C

Electrostatic Discharge – HBM

(JEDEC/ESDA JS-001-2012)

2000

(Class 2)

V

Electrostatic Discharge – CDM

(JEDEC 22-C101F)

500

(Class C2)

V