f=1MHz

f=1MHz

1

2

3

4

5

Drain-Source Leakage Current

Gate-Source Threshold Voltage

Drain-Source On Resistance

Drain-Source On Resistance

Forward Transconductance

Forward On Voltage

Reverse Recovery Time

Reverse Recovery Charge

Drain-Source Breakdown Voltage

Gate-Source Leakage Current

N-Channel (Q2,Q4,Q6)

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

P-CHANNEL (Q1,Q3,Q5)

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

BODY DIODE

570mJ

180mJ

+175°C MAX

-55°C to +150°C

-55°C to +125°C

300°C MAX

Single Pulse Avalanche Energy

(Q2,Q4,Q6)

(Q1,Q3,Q5)

Junction Temperature

Storage Temperature

Case Operating Temperature Range

Lead Temperature Range

(10 Seconds)

Drain to Source Voltage

Drain to Gate Voltage

(RGS=1MΩ)

Gate to Source Voltage (Continuous)

Continuous Current (N-Channel)

(P-Channel)

Pulsed Current (N-Channel)

(P-Channel)

Thermal Resistance (Junction to Case)

(N-Channel FETs)

(P-Channel FETs)

ABSOLUTE MAXIMUM RATINGS

55V MAX

55V MAX

±20V MAX

30A MAX

14A MAX

40A MAX

20A MAX

2°C/W

6°C/W

Parameter

Units

MSK3018

Test Conditions

V

µA

µA

nA

V

V

Ω

Ω

Ω

Ω

S

S

nC

nC

nC

nS

nS

nS

nS

pF

pF

pF

nC

nC

nC

nS

nS

nS

nS

pF

pF

pF

V

V

nS

nS

nC

nC

Min.

55

-

-

-

2.0

-2.0

-

-

-

-

30

4.2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Typ.

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

14

62

47

58

3400

830

240

-

-

-

13

55

130

41

620

280

140

1.3

-1.6

120

54

510

110

Max.

-

25

-25

±100

4.5

-4.5

0.04

0.16

0.013

0.10

-

-

150

24

55

-

-

-

-

-

-

-

35

7.9

16

-

-

-

-

-

-

-

-

-

190

82

760

160

ELECTRICAL SPECIFICATIONS

2

1

3

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

NOTES:

This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.

Resistance as seen at package pins.

Resistance for die only; use for thermal calculations.

Test limits due to autotest fixturing constraints.

4

Rev. A 7/00

2

5