| Electronic Components Datasheet Search |
|
BMF055 Datasheet(PDF) 19 Page - Bosch Sensortec GmbH |
|
|
|||||||||||||||||||||||||||||
BMF055 Datasheet(HTML) 19 Page - Bosch Sensortec GmbH |
|
19 / 22 page ![]() BMF055 Data sheet Page 19 BST-BMF055-DS000-01 | R evision 0.1 | N ovem ber 2015 Bosch Sensortec © Bosch Sensortec Gm bH reserves all rights even i n the event of i ndustrial property rights. We reserve all rights of disposal such as copying and passi ng on to third parties. BOSCH and the symbol are registered tradem arks of Robert Bosch GmbH, Germany. Note: Specifications within this document ar e subject to change without notice. 10.2 Landing pattern recommendation Please refer to the Handling, mounting and soldering instructions document for BNO055. 10.3 Marking Table 10-1: Marking of mass production parts Labeling Name Symbol Remark Pin 1 identifier • --- First Row S Internal use Second Row T Internal use Third Row C Numerical counter 10.4 Soldering Guidelines The moisture sensitivity level of the BMF055 sensors corresponds to JEDEC Level 1, see also - IPC/JEDEC J-STD-020C "Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non-hermetic Solid State Surface Mount Devices" - IPC/JEDEC J-STD-033A "Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices" The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard, i.e. reflow soldering with a peak temperature up to 260°C. 10.5 Handling instructions Micromechanical sensors are designed to sense acceleration with high accuracy even at low amplitudes and contain highly sensitive structures inside the sensor element. The MEMS sensor can tolerate mechanical shocks up to several thousand g's. However, these limits might be exceeded in conditions with extreme shock loads such as e.g. hammer blow on or next to the sensor, dropping of the sensor onto hard surfaces etc. We recommend avoiding g-forces beyond the specified limits during transport, handling and mounting of the sensors in a defined and qualified installation process. This device has built-in protections against high electrostatic discharges or electric fields (e.g. 2kV HBM); however, anti-static precautions should be taken as for any other CMOS component. Unless otherwise specified, proper operation can only occur when all terminal voltages are kept within the supply voltage range. Unused inputs must always be tied to a defined logic voltage level. SSS TTTT CCC |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |