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MSM6655 Datasheet(PDF) 43 Page - OKI electronic componets |
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MSM6655 Datasheet(HTML) 43 Page - OKI electronic componets |
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43 / 45 page ![]() 43/45 ¡ Semiconductor MSM6650 Family FEDL6650-03 (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP64-P-1420-1.00-BK Package material Lead frame material Pin treatment Package weight (g) Oki Electric Industry Co., Ltd. Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5 mm) 1.25 TYP. 4/Nov. 28, 1996 Mirror finish |
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