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TMP117

SNOSD82B – JUNE 2018 – REVISED MARCH 2019

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Copyright © 2018–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

Switching Characteristics .......................................... 6

6.7

Two-Wire Interface Timing ........................................ 7

6.8

Typical Characteristics .............................................. 8

7

Detailed Description ............................................ 10

7.1

Overview ................................................................. 10

7.2

Functional Block Diagrams ..................................... 10

7.3

Feature Description................................................. 10

7.4

Device Functional Modes........................................ 13

7.5

Programming........................................................... 17

7.6

Register Map........................................................... 24

8

Application and Implementation ........................ 32

8.1

Application Information............................................ 32

8.2

Typical Application ................................................. 32

9

Power Supply Recommendations ...................... 35

10

Layout................................................................... 36

10.1

Layout Guidelines ................................................. 36

10.2

Layout Examples................................................... 38

11

Device and Documentation Support ................. 39

11.1

Documentation Support ....................................... 39

11.2

Receiving Notification of Documentation Updates 39

11.3

Community Resources.......................................... 39

11.4

Trademarks ........................................................... 39

11.5

Electrostatic Discharge Caution ............................ 39

11.6

Glossary ................................................................ 39

12

Mechanical, Packaging, and Orderable

Information ........................................................... 39

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (October 2018) to Revision B

Page

•

Moved the medical grade specs and RTD replacement information to the Features section .............................................. 1

•

Changed application bullets ................................................................................................................................................... 1

•

Added YBG (DSBGA) package information ........................................................................................................................... 1

•

Added YBG package accuracy image.................................................................................................................................... 1

•

Changed accuracy image to indicate DRV package .............................................................................................................. 1

•

Changed TJ(MAX) from 150 °C to 155 °C ............................................................................................................................. 4

•

Added YBG package thermal information .............................................................................................................................. 5

•

Added YBG package temperature accuracy chart ................................................................................................................. 8

•

Changed conversion cycle timing diagram........................................................................................................................... 13

•

Changed one-shot timing diagram with AVG[1:0] = 00 ........................................................................................................ 14

•

Changed alert mode timing diagram .................................................................................................................................... 15

•

Changed therm mode timing diagram .................................................................................................................................. 16

•

Changed write word command timing diagram .................................................................................................................... 21

•

Changed read word command timing diagram .................................................................................................................... 22

•

Changed SMBus alert timing diagram.................................................................................................................................. 22

•

Changed general-call reset command timing diagram ......................................................................................................... 23

•

Updated the formatting in the Register Map section ............................................................................................................ 24

•

Added return links to the register descriptions ..................................................................................................................... 24

•

Fixed access type code location and descriptions ............................................................................................................... 24

•

Changed typical connections diagram.................................................................................................................................. 32

•

Added YBG package layout example................................................................................................................................... 38