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EM5106VT Datasheet(PDF) 9 Page - Excelliance MOS Corp.

Part # EM5106VT
Description  3A Low Dropout LDO
PDF  10 Pages
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Manufacturer  EXCELLIANCE [Excelliance MOS Corp.]
Direct Link  http://www.excelliancemos.com/
Logo EXCELLIANCE - Excelliance MOS Corp.

EM5106VT Datasheet(HTML) 9 Page - Excelliance MOS Corp.

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2013/11/26
A.3
9
EM5106
Functional Description
Enable Function
EM5106 is enabled if the voltage of the EN pin is
greater than 1.1V. If the voltage of the EN pin is
less than 0.3V, the IC will be disabled. The
quiescent current can be decreased to be less than
10uA typically.
POR – Power ON Reset
To let EM5106 start to operation, CNTL voltage
must be higher than its POR voltage even when EN
voltage is pulled higher than enable high voltage.
Typical POR voltage is 2.7V.
VOUT Voltage Adjustment
The VOUT voltage of EM5106 can be adjusted by
external
voltage
divider.
Refer
to
typical
application circuit, VOUT voltage is calculated by
the following equation,
VOUT = (1 + R1/R2) x 0.8V
Over Current Limit Function
EM5106 features over current limiting function
which can limit its output current to 4.5A. When
current limit lasts over one millisecond, IC turns-off
the power device for few milliseconds and then
re-starts.
Input and Output Capacitor Selection
For CNTL pin, a 1uF ceramic capacitor is enough for
bypass the supply of CNTL to GND. For VIN pin,
10uF or larger ceramic capacitor is required to
provide bypass path in transient current demand.
VOUT pin is also recommended to have 10uF or
larger ceramic capacitor to be stable and reduce
the VOUT voltage dip when fast loading transient is
happened. A feed-forward capacitor can be placed
between VOUT and FB pin to speed up the
transient response, optionally.
Power Dissipation
The max power depends on some conditions,
including of thermal impedance, PCB layout,
airflow, and so on. The max power dissipation can
be calculated by the formula as below
PD(max)=(TJ(max)-TA) / θJA
TJ(max) is the max junction temperature; θJA is the
thermal impedance from junction to ambient. The
thermal impedance θJA of DFN3x3-10L is package
design and PCB design dependent. The thermal
impedance can be reduced by increasing the
copper area under the exposed pad of the
DFN3x3-10L package. So, to let the copper area as
large as possible is helpful for the thermal
performance of the DFN3x3-10L package.
For recommended specification of EM5106, the
max junction temperature is 125 degree C. The θJA
of DFN3x3-10L is 60°C/W on the standard JEDEC
51-7(4 layers, 2S2P, copper 2 oz) thermal test
board. The max power dissipation (at 25°C ambient,
on the min exposed pad layout) can be calculated
as below:
PD(max at 25°C)=(125°C–25°C)/(60°C/W) = 1.67W



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