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EM5106VT Datasheet(PDF) 9 Page - Excelliance MOS Corp. |
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EM5106VT Datasheet(HTML) 9 Page - Excelliance MOS Corp. |
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9 / 10 page ![]() 2013/11/26 A.3 9 EM5106 Functional Description Enable Function EM5106 is enabled if the voltage of the EN pin is greater than 1.1V. If the voltage of the EN pin is less than 0.3V, the IC will be disabled. The quiescent current can be decreased to be less than 10uA typically. POR – Power ON Reset To let EM5106 start to operation, CNTL voltage must be higher than its POR voltage even when EN voltage is pulled higher than enable high voltage. Typical POR voltage is 2.7V. VOUT Voltage Adjustment The VOUT voltage of EM5106 can be adjusted by external voltage divider. Refer to typical application circuit, VOUT voltage is calculated by the following equation, VOUT = (1 + R1/R2) x 0.8V Over Current Limit Function EM5106 features over current limiting function which can limit its output current to 4.5A. When current limit lasts over one millisecond, IC turns-off the power device for few milliseconds and then re-starts. Input and Output Capacitor Selection For CNTL pin, a 1uF ceramic capacitor is enough for bypass the supply of CNTL to GND. For VIN pin, 10uF or larger ceramic capacitor is required to provide bypass path in transient current demand. VOUT pin is also recommended to have 10uF or larger ceramic capacitor to be stable and reduce the VOUT voltage dip when fast loading transient is happened. A feed-forward capacitor can be placed between VOUT and FB pin to speed up the transient response, optionally. Power Dissipation The max power depends on some conditions, including of thermal impedance, PCB layout, airflow, and so on. The max power dissipation can be calculated by the formula as below PD(max)=(TJ(max)-TA) / θJA TJ(max) is the max junction temperature; θJA is the thermal impedance from junction to ambient. The thermal impedance θJA of DFN3x3-10L is package design and PCB design dependent. The thermal impedance can be reduced by increasing the copper area under the exposed pad of the DFN3x3-10L package. So, to let the copper area as large as possible is helpful for the thermal performance of the DFN3x3-10L package. For recommended specification of EM5106, the max junction temperature is 125 degree C. The θJA of DFN3x3-10L is 60°C/W on the standard JEDEC 51-7(4 layers, 2S2P, copper 2 oz) thermal test board. The max power dissipation (at 25°C ambient, on the min exposed pad layout) can be calculated as below: PD(max at 25°C)=(125°C–25°C)/(60°C/W) = 1.67W |
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