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SS30 Datasheet(PDF) 1 Page - TOKYO SEIMITSU CO., LTD |
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SS30 Datasheet(HTML) 1 Page - TOKYO SEIMITSU CO., LTD |
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1 / 2 page ![]() SEMI-AUTOMATIC DICING SAW New standard for semi-automatic dicers with enhanced operability Small footprint with highly stable structure Footprint ・300mm wafer ・Alignment with multiple works attachment ・Deformed and elastic work alignment Compliant with varieties of work Improved resolution High-resolution microscope Improved operability with the 17-inch touch panel screen User Friendly design |
Similar Part No. - SS30 |
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Similar Description - SS30 |
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