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CY7C109 Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C109
Description  128K x 8 Static RAM
PDF  12 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C109 Datasheet(HTML) 1 Page - Cypress Semiconductor

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128K x 8 Static RAM
CY7C109
CY7C1009
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05032 Rev. **
Revised August 24, 2001
009
Features
• High speed
—tAA = 10 ns
• Low active power
— 1017 mW (max., 12 ns)
• Low CMOS standby power
— 55 mW (max.), 4 mW (Low power version)
• 2.0V Data Retention (Low power version)
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Easy memory expansion with CE1, CE2, and OE options
Functional Description
The CY7C109 / CY7C1009 is a high-performance CMOS stat-
ic RAM organized as 131,072 words by 8 bits. Easy memory
expansion is provided by an active LOW chip enable (CE1), an
active HIGH chip enable (CE2), an active LOW output enable
(OE), and three-state drivers. Writing to the device is accom-
plished by taking chip enable one (CE1) and write enable (WE)
inputs LOW and chip enable two (CE2) input HIGH. Data on
the eight I/O pins (I/O0 through I/O7) is then written into the
location specified on the address pins (A0 through A16).
Reading from the device is accomplished by taking chip en-
able one (CE1) and output enable (OE) LOW while forcing
write enable (WE) and chip enable two (CE2) HIGH. Under
these conditions, the contents of the memory location speci-
fied by the address pins will appear on the I/O pins.
The eight input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE1
HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE1 LOW, CE2 HIGH, and WE LOW).
The CY7C109 is available in standard 400-mil-wide SOJ and
32-pin TSOP type I packages. The CY7C1009 is available in
a 300-mil-wide SOJ package. The CY7C1009 and CY7C109
are functionally equivalent in all other respects.
Logic Block Diagram
Pin Configurations
A1
A2
A3
A4
A5
A6
A7
A8
COLUMN
DECODER
INPUT BUFFER
POWER
DOWN
WE
OE
I/O0
CE2
I/O1
I/O2
I/O3
512 x256 x8
ARRAY
I/O7
I/O6
I/O5
I/O4
A0
CE1
1
2
3
4
5
6
7
8
9
10
11
14
19
20
24
23
22
21
25
28
27
26
Top View
SOJ
12
13
29
32
31
30
16
15
17
18
GND
A16
A14
A12
A7
A6
A5
A4
A3
WE
VCC
A15
A13
A8
A9
I/O7
I/O6
I/O5
I/O4
109–1
A2
NC
I/O0
I/O1
I/O2
CE1
OE
A10
I/O3
A1
A0
A11
CE2
109–2
A6
A7
A16
A14
A12
WE
VCC
A4
A13
A8
A9
OE
TSOP I
Top View
(not to scale)
1
6
2
3
4
5
7
32
27
31
30
29
28
26
21
25
24
23
22
19
20
I/O2
I/O1
GND
I/O7
I/O4
I/O5
I/O6
I/O0
CE
A11
A5
17
18
8
9
10
11
12
13
14
15
16
CE2
A15
NC
A10
I/O3
A1
A0
A3
A2
109–3
Selection Guide
7C109-10
7C1009-10
7C109-12
7C1009-12
7C109-15
7C1009-15
7C109-20
7C1009-20
7C109-25
7C1009-25
7C109-35
7C1009-35
Maximum Access Time (ns)
10
12
15
20
25
35
Maximum Operating Current (mA)
195
185
155
140
135
125
Maximum CMOS Standby Current (mA)
10
10
10
10
10
10
Maximum CMOS Standby Current (mA)
Low Power Version
2
2
2
—
—
—
Shaded areas contain preliminary information.


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