www.disco.co.jp

Automatic Die Separator

DDS2010

2014.11

No pattern side protective film required during breaking

Stealth Dicing

Front side: Pattern side

Bottom side: Backside

No pattern side

protective film required

Front side: Pattern side

Separation side: Backside

Reduced die damage during expansion

Space between die reduces

the chance of impact

Step 1: Expansion

Step 2: CH1 & CH2 breaking

No breakage from impact between

die

specification

Environmental conditions

• Use clean, oil-free air at a dew point of -15 ℃ or less. (Use a residual oil: 0.1ppm. Filtration rating: 0.01 µm/99.5 % or more).

• Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).

• Keep cutting water and cooling water at the same (within ±1 ℃ fluctuations) temperature as the room.

• Use water that has a specific electric conductivity greater than 1µS for cutting.

• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.

• This machine uses water.

In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.

* All the pressures are described using gauge pressures.

* The above specifications may change due to technical modifications. Please

confirm when placing your order.

* For further information please contact your local sales representatives

Unit

mm

φ

8"

mm

0.1～0.5(narrow side)

mm

±2.5

deg

±3°

mm

718×897×1608

(including status indicator)

kg

Approx.450

Specification

Workpiece size

Dice size

Wafer mounting accuracy

X/Y direction (frame mount)

Wafer mounting accuracy

θ direction (frame mount)

Machine dimensions (W×D×H)

Machine weight