DFD6363

Flagship model for ø300 mm wafers with

high process extensibility

Fully Automatic Dicing Saw

19-inch monitor (1280 x 1024 px)

*Option

Supports various applications

 Supports multiple types of cassette; standard wafer cassettes (ø200 mm /

ø300 mm) and FOUP cassettes

 Supports various processes including full cut and half cut with only one unit

DFD6363.

 Reduces the number of size conversions and prevents size conversion

errors.

 Minimizes the equipment downtime by automatically detecting the end of

blade life and performing operations from blade replacement to processing

recovery in fully automatic operation.

 Prevents potential human errors during blade replacement required for a

change of workpieces to be processed.

 Improves traceability.

Basic function improvements

 Improved usability through a 19-inch monitor and highly visible GUI.

 Contributes to reduced processing time by optimizing axis operation

through multiple-axis synchronized control.

 Improves productivity using a new NCS (Non-Contact Setup)* sensor.

 Achieves stable processing through the installation of a newly-

developed 1.8 kW spindle (60,000 min-1).

ABC unit