DFG8340

Fully Automatic In-Feed Surface Grinder

[1] The robot pick removes the wafer from the cassette and

places it on the positioning table, where centering takes place.

[2] The transfer arm places the wafer on the chuck table.

[3] Grinding. [4] The transfer arm removes the wafer from the

chuck table and places it on the spinner. [5] Cleaning and

drying. [6] The robot pick returns the workpiece to the cassette.

Dec. 2017

Specifications

Easy Operation

The DFG8340 utilizes an

LCD touch screen graphical

user interface, making

operation and maintenance

intuitive and easy.

Environmental conditions

•Use clean, oil-free air at a dew point of -15ºC or less. (Use a residual oil: 0.1 ppm. Filtration rating: 0.01 µm/99.5% or more).

•Keep room temperature fluctuations within ±1ºC of the set value. (Set value should be between 20 - 25 ºC).

•Keep grinding water and cleaning water + 0 - 2ºC above room temperature (fluctuations within 1ºC over one hour).

•Keep spindle cooling water temperature between 20 - 25ºC (fluctuations within 2ºC over an hour).

•The equipment should be used in an environment free from external vibration. Do not install the equipment near a ventilation opening, equipment that generates heat, or parts that generate oil mist.

• The above specifications may change due to technical modifications. Please confirm when placing your order.

• For more information, please contact your local sales representatives.

www.disco.co.jp

Simplified Wafer Shape Adjustment

By adjusting the wafer shape from the operation panel in one

touch based on the workpiece, DFG8340 achieves high-

precision for a variety of workpieces.

Operation panel

Unit

mm

φ 4"/5"/6"/8"

-

In-feed grinding with

wafer Rotation

mm

φ 200 diamond wheel

Output

kW

4.2

Revolution speed

range

min

-1

1,000　-　7,000

Thickness variation

within one wafer

µm

Less than 1.5

Thickness variation

between wafers

µm

Less than ±1.5

Finished surface

roughness

µm

Ry less than 0.13

(#2000 fine grinding)

mm

800 × 2,450 × 1,800

kg

Approx.2,500

Machine weight

Machine dimensions(W×D×H)

Grinding

Accuracy

Specification

Wafer Diameter

Grinding Method

Grinding Wheels

Spindle