Fully Automatic In-Feed Surface Grinder

DFG8540/8560

Specifications

Safe wafer handling with the thin wafer robot pick

Environmental conditions

• Use clean, oil-free air at a dew point of -15 ℃ or less. (Use a residual oil: 0.1 ppm. Filtration ratinｚg: 0.01 µm/99.5 % or more).

• Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).

• Keep grinding water and cleaning water + 0 - 2 ℃ above room temperature (fluctuations within 1 ℃ over one hour).

• Keep spindle cooling water temperature between 20 - 25 ℃ (fluctuations within 2 ℃ over an hour).

• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.

• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.

* All the pressures are described using gauge pressure.

* The above specifications may change due to technical modifications. Please confirm when placing your order.

* For further information please contact your local sales representatives.

DFG8540

Unit

DFG8540

DFG8560

-

φ 8"

(φ 4"/5"/6"/8")

φ 300

（

φ 200/φ 300）

-

mm

φ 200(φ 8")

Diamond wheel

φ 300

Diamond wheel

kW

4.2

4.8

min

1,000 ～ 4,000

Thickness

variation

within one

wafer

µm

1.5 or less

(with

dedicated

chuck table)

3.0 or less

（with dedicated

chuck table,

φ 300mm wafer）

Thickness

variation

between

wafers

µm

Finished

surface

roughness

µm

mm

1,200 × 2,670

× 1,800

1,400 × 3,322

× 1,800

kg

Approx.3,100

Approx.4,000

In-feed grinding with wafer Rotation

Spindle

Rated output

Rated torque

range

Griding wheels

Grinding

Accuracy

±3.0 or less

BG

Ry 0.13(with #2000 finish)

Ry 0.15(with #1400 finish)

Specification

Wafer diameter

Grinding method

Machine weight

Machine

dimensions(W×D×H)

www.disco.co.jp

2017.12