For the separation and recovery of high purity

silicon sludge from grinding water.

Water-Sludge Separator

Low cost recovery of silicon sludge

DISCO has developed the DWS1820, which uses a unique filter-less technology to

separate and recover silicon sludge (water containing silicon content) from the

wastewater created in the wafer backside grinding process for semiconductor

manufacturing.

The filter-less technology means that the DWS1820 is comparatively low cost when

compared with existing systems that use a large number of filters.

Realizes a significant footprint reduction

The DWS1820 features a 0.79 ㎡ space saving design, which is approximately 1/8*

the footprint of existing systems.

*When comparing an existing system (Flow rate: 10 m³/h) with 6 DWS1820 units

(equivalent capacity).

Can be combined with our DWR series, DI water

recycling equipment, to recycle the DI water in

grinding wastewater.

Recycling the DI water in grinding wastewater using DWR series equipment alone is

currently difficult due to high silicon sludge content. However, the DWR series can

now be used in combination with the DWS1820 to make this application possible.

DWS1820

DWS1820

Specification

DI water

Grinder

wastewater

Purity : 99% or more

Water content:

Less than 50%

Si sludge

Grinder

Water-Sludge Separator

Separation

DWR series

Sent to wastewater

treatment facilities

Filtered water

DI water recycle

DI water recycle with DWR series

Unit

Flow rate

L/min

30

Silicon separation ability

%

99

Machine dimensions

(W x D x H)

mm

600 x 1,165 x 1,800

Machine weight

kg

620 (when it is dry)

Utilities

Specification

Waste water

treatment

ability

Environmental conditions

• Use clean, oil-free air at a dew point of -15 ℃ or less. (Use a residual oil: 0.1ppm. Filtration rating: 0.01

µm/99.5 % or more).

• Keep room temperature fluctuations within ±1 ℃ of the set value. (Set value should be between 20 - 25 ℃).

• Keep cutting water and cooling water at the same (within ±1 ℃ fluctuations) temperature as the room.

• Use water that has a specific electric conductivity greater than 1µS for cutting.

• The machines should be used in an environment, free from external vibration. Do not install machine near a

ventilation opening, heat generation equipment or oil mist generating parts.

• This machine uses water.

In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage

treatments.

* All the pressures are described using gauge pressures.

* The above specifications may change due to technical modifications. Please

confirm when placing your order.

* For further information please contact your local sales representatives

2014.11