HT48E06 datasheet(3/43 Pages) HOLTEK

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Pad Description

Pad Name

I/O

Options

Description

PA0~PA7

I/O

Pull-high*

Wake-up

Bidirectional 8-bit input/output port. Each bit can be configured as a

wake-up input by options. Software instructions determine the CMOS

output or Schmitt trigger input with pull-high resistor (determined by

pull-high options).

PB0/BZ

PB1/BZ

PB2~PB7

I/O

Pull-high*

PB0 or BZ

PB1 or BZ

Bidirectional 8-bit input/output port. Software instructions determine the

CMOS output or Schmitt trigger input with pull-high resistor (deter-

mined by pull-high options).

The PB0 and PB1 are pin-shared with BZ and BZ, respectively. Once

PB0 or PB1 is selected as buzzer driving output, the output signals

come from an internal PFD generator (shared with timer/event coun-

ter).

VSS

¾¾

Negative power supply, ground

PC0/INT

PC1/TMR

I/O

Pull-high*

Bidirectional I/O lines. Software instructions determine the CMOS out-

put or Schmitt trigger input with pull-high resistor (determined by

pull-high options). The external interrupt and timer input are pin-shared

with PC0 and PC1, respectively. The external interrupt input is acti-

vated on a high to low transition.

RES

Schmitt trigger reset input. Active low.

VDD

¾¾

Positive power supply

OSC1

OSC2

Crystal or RC

OSC1and OSC2 are connected to an RC network or Crystal (deter-

mined by options) for the internal system clock. In the case of RC oper-

ation, OSC2 is the output terminal for 1/4 system clock.

Note:

²*² All pull-high resistors are controlled by an option bit.

Absolute Maximum Ratings

Supply Voltage ...........................VSS

-0.3V to VSS+6.0V

Storage Temperature ............................

-50°Cto125°C

Input Voltage..............................VSS

-0.3V to VDD+0.3V

Operating Temperature...........................

-40°Cto85°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT48E06

Rev. 0.00

January 12, 2004

Preliminary

HT48E06 Datasheet(PDF) 3 Page - Holtek Semiconductor Inc

HT48E06 Datasheet(HTML) 3 Page - Holtek Semiconductor Inc

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