TMP236 datasheet(4/20 Pages) TI1

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TMP235-Q1, TMP236-Q1

SBOS939 – APRIL 2019

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings

only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended

OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VDD

Output voltage, VOUT

–0.3

(VDD + 0.3)

Output current

–30

+30

Latch-up current, each pin

–200

+200

Junction temperature (TJ)

+150

°C

Storage temperature (Tstg)

–65

+150

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

±2000

V(ESD)

Electrostatic discharge

Charged device model (CDM), per AEC Q100-011: All Pins

±500

V(ESD)

Electrostatic discharge

Charged device model (CDM), per AEC Q100-011: Corner Pins

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Input voltage (TMP235-Q1)

2.3

5.5

Input voltage (TMP236-Q1)

3.1

5.5

Operating free-air temperature

–50

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

For information on self-heating and thermal response time see Layout Guidelines section.

(3)

The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K

board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are

included in the PCB, per JESD 51-5.

(4)

Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

6.4 Thermal Information

THERMAL METRIC (1)(2)

TMP23X-Q1

UNIT

DCK (SC70)

DBZ (SOT-23)

PINS

RθJA

Junction-to-ambient thermal resistance(3)(4)

275

167

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

146

°C/W

ΨJT

Junction-to-top characterization parameter

1.2

°C/W

ΨJB

Junction-to-board characterization parameter

146

°C/W

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