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54HC138 Datasheet(PDF) 1 Page - Silicon Supplies

Part # 54HC138
Description  High Speed CMOS Logic
PDF  6 Pages
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Manufacturer  SS [Silicon Supplies]
Direct Link  https://siliconsupplies.com/
Logo SS - Silicon Supplies

54HC138 Datasheet(HTML) 1 Page - Silicon Supplies

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High Speed CMOS Logic – 54HC138
Rev 1.0
23/11/17
 
3-Line to 8-Line Decoder / Demultiplexer in bare die form
 
 
Output Drive Capability: 10 LSTTL Loads
Low Input Current: 1µA
Outputs directly interface CMOS, NMOS and TTL
 
 
Operating Voltage Range: 2V to 6V
CMOS High Noise Immunity
 
Function compatible with 54LS138
 
Full Military Temperature Range.
 
 
 
Features:
Ordering Information
The 54HC138 is fabricated using a 2.5µm 5V CMOS
process with the same high speed performance of LSTTL
combined with CMOS low power consumption. Inputs are
compatible with standard CMOS outputs and LSTTL
outputs by using pull-up resistors. The device decodes a
three–bit Address to one–of–eight active–low outputs.
Featuring three Chip Select inputs, two active–low & one
active–high to facilitate the demultiplexing, cascading, and
chip–selecting functions. The demultiplexing function uses
the Address inputs to select desired device output; one of
the Chip Selects is used as a data input while the other
Chip Selects are held in their active states.
Description
Die Dimensions in µm (mils)
 
The following part suffixes apply:
1450 (57)
 
No suffix - MIL-STD-883 /2010B Visual Inspection
 
“H” - MIL-STD-883 /2010B Visual Inspection
+ MIL-PRF-38534 Class H LAT
 
 
“K” - MIL-STD-883 /2010A Visual Inspection (Space)
+ MIL-PRF-38534 Class K LAT
LAT = Lot Acceptance Test.
 
 
For more information on LAT flows please see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
 
 
Die Size (Unsawn)
1450 x 1500
57 x 59
µm
 
 
 
 
mils
Minimum Bond Pad Size
100 x 100
4 x 4
µm
mils
Die Thickness
350 (±20)
13.78 (±0.79)
µm
mils
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (400 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 350µm(14 Mils) – On request
Top Metal Composition
Al 1%Si 1.1µm
Back Metal Composition
N/A – Bare Si
Assembled into Ceramic Package – On request
Page 1 of 6 
www.siliconsupplies.com


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