FR9855 datasheet(14/16 Pages) FITIPOWER

14 / 16 page

FR9855-Preliminary 0.3-JAN-2016

FR9855

85T

Application Information (Continued)

PCB Layout Recommendation

The

device’s

performance

and

stability

dramatically

affected

PCB

layout.

recommended to follow these general guidelines

shown as below:

1. Place the input capacitors and output capacitors

as close to the device as possible. Trace to these

capacitors should be as short and wide as

possible to minimize parasitic inductance and

resistance.

2. Place feedback resistors close to the FB pin.

3. Keep the sensitive signal (FB) away from the

switching signal (LX).

4. The exposed pad of the package should be

soldered to an equivalent area of metal on the

PCB.

This area should connect to the GND

plane and have multiple via connections to the

back of the PCB as well as connections to

intermediate PCB layers.

The GND plane area

connecting

the

exposed

pad

should

maximized to improve thermal performance.

5. Multi-layer PCB design is recommended.

VOUT

VIN

Exposed

Pad

GND

Figure 28. Recommended PCB Layout Diagram for

SP Package

VOUT

VIN

GND

1 2 3 4 5

Exposed

Pad

Figure 29. Recommended PCB Layout Diagram for

DA Package

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