SM320VC33 datasheet(22/54 Pages) TI

22 / 54 page

SM320VC33, SMJ320VC33

DIGITAL SIGNAL PROCESSOR

SGUS034E - FEBRUARY 2001 - REVISED OCTOBER 2002

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251-1443

device and development support tool nomenclature (continued)

PREFIX

SMJ

320

VC 33 GNM

SMX = experimental device

TMP = prototype device

TMS = qualified device

SMJ = MIL-PRF-38535 (QML)

SMQ= QML Plastic device

SM = Commericial processing

DEVICE FAMILY

320 = TMS320 Family

TECHNOLOGY

TEMPERATURE RANGE

M = Military

C = CMOS

E = CMOS EPROM

F = CMOS Flash EEPROM

LC = Low-Voltage CMOS (3.3 V)

VC = Low-Voltage CMOS [3 V (2.5 V

or 1.8 V core)]

UC= Ultra Low-Voltage CMOS [1.8 V

(1.5 V core)]

DEVICE

3x DSP:

4x DSP:

6x DSP:

6201 6201

6701 6211

† QFP = Quad Flat Package

LQFP = Low-Profile Quad Flat Package

BGA = Ball Grid Array

PACKAGE TYPE†

HFG = 164-pin ceramic QFP

GNL = 144-pin ceramic BGA, hermetic

GNM = 144-pin ceramic BGA, non-hermetic

SPEED

150 = 150 MFLOPS

150

Figure 13. TMS320

 DSP Device Nomenclature

SM320VC33 Datasheet(PDF) 22 Page - Texas Instruments

SM320VC33 Datasheet(HTML) 22 Page - Texas Instruments

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