DS563F2

13

CS5381

DC ELECTRICAL CHARACTERISTICS

(GND = 0 V, all voltages with respect to ground. MCLK=12.288 MHz; Master Mode)

8.

Power-Down Mode is defined as RST = Low with all clocks and data lines held static.

9.

Valid with the recommended capacitor values on FILT+ and VQ as shown in the Typical Connection

Diagram.

DIGITAL CHARACTERISTICS

THERMAL CHARACTERISTICS

Parameter

Symbol

Min

Typ

Max

Unit

Power Supply Current

VA = 5 V

(Normal Operation)

VL,VD = 5 V

VL,VD = 3.3 V

-

-

-

36

36

24

43

46

28

mA

mA

mA

Power Supply Current

VA = 5 V

(Power-Down Mode) (Note 8)

VL,VD = 5 V

-

-

100

100

-

-

uA

uA

Power Consumption

(Normal Operation)

VA, VL, VD = 5 V

VA = 5 V; VL, VD = 3.3 V

(Power-Down Mode)

-

-

-

-

-

-

360

260

1

445

307

-

mW

mW

mW

Power Supply Rejection Ratio (1 kHz)

(Note 9)

PSRR

-

65

-

dB

Output Impedance

Maximum allowable DC current source/sink

-

-

-

2.5

25

0.01

-

-

-

V

k

Ω

mA

Filt+ Nominal Voltage

Output Impedance

Maximum allowable DC current source/sink

-

-

-

5

4.5

0.01

-

-

-

V

k

Ω

mA

Parameter

Symbol

Min

Typ

Max

Units

High-Level Input Voltage

(% of VL)

70%

-

-

V

Low-Level Input Voltage

(% of VL)

--

30%

V

(% of VL)

70%

-

-

V

(% of VL)

--

15%

V

OVFL Current Sink

--

4.0

mA

Input Leakage Current

-10

-

10

µA

Parameter

Symbol

Min

Typ

Max

Unit

Allowable Junction Temperature

--

135

°C

Junction to Ambient Thermal Impedance

(Multi-layer PCB) TSSOP

(Multi-layer PCB) SOIC

(Single-layer PCB) TSSOP

(Single-layer PCB) SOIC

θ

JA-TM

θ

JA-SM

θ

JA-TS

θ

JA-SS

-

-

-

-

70

60

105

80

-

-

-

-

°C/W

°C/W

°C/W

°C/W