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AW9656 Datasheet(PDF) 13 Page - Shanghai awinic technology co.,ltd

Part # AW9656
Description  6-Channel 1X/2X Adaptive Charge Pump White LED Driver with 1-Wire Brightness Control
PDF  18 Pages
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Manufacturer  AWINIC [Shanghai awinic technology co.,ltd]
Direct Link  http://www.awinic.com.cn/index.php
Logo AWINIC - Shanghai awinic technology co.,ltd

AW9656 Datasheet(HTML) 13 Page - Shanghai awinic technology co.,ltd

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AW9656
March 2018 V1.1
www.awinic.com.cn
13
Copyright © 2018 SHANGHAI AWINIC TECHNOLOGY CO., LTD
IN
F
OUT
IN
OUT
F
IN
IN
OUT
F
IN
OUT
V
×
V
=
I
×
V
×
I
×
V
≈
I
×
V
×
I
×
V
=
P
P
=
2
2
2
η
For a white LED with the forward voltage of 3.2V
(25mA), the power efficiency is 53.5% approxi-
mately when the input voltage is 3.0V.
Power dissipation
The maximum power dissipation inside the AW9656
can be calculated based on the following equation:
OUT
F
Dmax
I
)
V
VIN
2
(
P
×
-
×
=
The maximum power dissipation occurs when the
input voltage is up to the VB (the mode transition
voltage from 1X to 2X). This need to be lower than
the maximum allowed power dissipation of the
package, which can be calculated by using the fol-
lowing equation:
θja
A
Jmax
package
Dmax,
T
T
T
P
-
=
PCB Layout Consideration
The AW9656 is a high-frequency charge pump
converter. Careful PCB layout routing is necessary
to achieve a good and efficient operating of the de-
vice and fully exploit its performance. The following
guidelines should be strictly followed for the layout
of the AW9656:
1.
Place all peripheral components as close to the
device as possible. Place CIN, COUT, Cflying and
RISET close to the VIN, VOUT C+, C- and the
ISET pin respectively. The connection between
the pins and the component pads should be
copper traces without any through-hole via
connection.
2.
The VIN traces should be wide enough to min-
imize parasitic inductance and parasitic re-
sistance. The trace running from the battery to
the device should be place carefully and
shielded strictly.
3.
The CIN, COUT and Cflying must be place close the
device and the traces running from the capacitor
pads to the pins should be as wide and short as
possible to reduce the noise and EMI.
4.
The exposed pad, PGND and GND must be
soldered to a large ground plane for heat sink-
ing and noise prevention. The through-hole vias
located at the exposed pad is connected to the
ground plane of the internal layer.
The recommended PCB layout of the AW9656 is
shown in Figure 11.
Figure 11 Recommended PCB layout of the AW9656



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