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AW9656 Datasheet(PDF) 13 Page - Shanghai awinic technology co.,ltd |
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AW9656 Datasheet(HTML) 13 Page - Shanghai awinic technology co.,ltd |
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13 / 18 page ![]() AW9656 March 2018 V1.1 www.awinic.com.cn 13 Copyright © 2018 SHANGHAI AWINIC TECHNOLOGY CO., LTD IN F OUT IN OUT F IN IN OUT F IN OUT V × V = I × V × I × V ≈ I × V × I × V = P P = 2 2 2 η For a white LED with the forward voltage of 3.2V (25mA), the power efficiency is 53.5% approxi- mately when the input voltage is 3.0V. Power dissipation The maximum power dissipation inside the AW9656 can be calculated based on the following equation: OUT F Dmax I ) V VIN 2 ( P × - × = The maximum power dissipation occurs when the input voltage is up to the VB (the mode transition voltage from 1X to 2X). This need to be lower than the maximum allowed power dissipation of the package, which can be calculated by using the fol- lowing equation: θja A Jmax package Dmax, T T T P - = PCB Layout Consideration The AW9656 is a high-frequency charge pump converter. Careful PCB layout routing is necessary to achieve a good and efficient operating of the de- vice and fully exploit its performance. The following guidelines should be strictly followed for the layout of the AW9656: 1. Place all peripheral components as close to the device as possible. Place CIN, COUT, Cflying and RISET close to the VIN, VOUT C+, C- and the ISET pin respectively. The connection between the pins and the component pads should be copper traces without any through-hole via connection. 2. The VIN traces should be wide enough to min- imize parasitic inductance and parasitic re- sistance. The trace running from the battery to the device should be place carefully and shielded strictly. 3. The CIN, COUT and Cflying must be place close the device and the traces running from the capacitor pads to the pins should be as wide and short as possible to reduce the noise and EMI. 4. The exposed pad, PGND and GND must be soldered to a large ground plane for heat sink- ing and noise prevention. The through-hole vias located at the exposed pad is connected to the ground plane of the internal layer. The recommended PCB layout of the AW9656 is shown in Figure 11. Figure 11 Recommended PCB layout of the AW9656 |
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