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GD5F2GQ4RF9JS Datasheet(PDF) 55 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD5F2GQ4RF9JS Datasheet(HTML) 55 Page - GigaDevice Semiconductor (Beijing) Inc. |
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55 / 57 page ![]() SPI(x1/x2/x4) NAND Flash 2G 55 23 REVISION HISTORY Version No Description Date Page 1.0 Initial Release 2017-07-03 1.1 Add parameter page CRC value 2017-07-14 1.2 Modify Package TFBGA-24BALL (6*8 ball array) Delete Package WSON8 (6*8mm) & SOP16 300MIL 2017-7-20 1.3 Modify the Number of Figure and Table Modify Package ‘R’ description Reduce the size of parameter page device model table Modify TFBGA-24BALL description Modify Read CID command sequence description 2017-9-1 1.4 Delete Package WSON8 in ORDERING INFORMATION 2017-9-26 1.5 Add the Note article 4 of Page Program 2017-10-23 1.6 Add the chapter of Valid Part Numbers 2017-11-03 1.7 Add the description of 2Gb SLC NAND Flash Add the description of Reliability Modify the Figure of Program Load Sequence Diagram typo Modify the package of LGA8 2017-12-11 1.8 Modify the package of TFBGA24 Modify the typo of LGA8 2017-12-27 1.9 Add LGA8 package description for hardware reset section 2018-1-16 2.0 Modify some typo Add Temperature Range J:Industrial(-40 ℃ to 105℃) and related description Change Memory Mapping CA from<12:0> to <11:0> Add byte1 and byte2 for two Device ID in Read Sequence Diagram Add page size 2048bytes + 64bytes with ECC enabled Modify figures11-1,11-2,11-4,11-5,11-6 from Byte 2175 to 2175/2111 and add a note to explain Change Parameter page table Byte 105-106 and 108-109,and change CRC Value Merge chapters 2.1 and 21.1 Change the description of protection with WP# Pin 2018-2-13 2.1 Add Temperature Range F:Industrial+ (-40 ℃ to 85℃) 2018-3-12 2.2 Modify the Value of Applied Input/ Output Voltage and VCC in Chapter16 Modify the description of LGA8 6*8mm package Update Ordering Information 2018-7-25 2.3 Modify the file name Update the ordering information 2018-10-22 2.4 Add Note describe the spare size with Internal ECC ON. 2019-3-25 4/9 |
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