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ADRF5046BCCZN-R7 Datasheet(PDF) 5 Page - Analog Devices |
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ADRF5046BCCZN-R7 Datasheet(HTML) 5 Page - Analog Devices |
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5 / 15 page ![]() Data Sheet ADRF5046 Rev. 0 | Page 5 of 15 ABSOLUTE MAXIMUM RATINGS For recommended operating conditions, see Table 1. Table 2. Parameter Rating Supply Voltage Positive −0.3 V to +3.6 V Negative −3.6 V to +0.3 V Digital Control Inputs Voltage −0.3 V to VDD +0.3 V RFx Input Power (f1 = 200 MHz to 40 GHz, TCASE = 85°C2) Through Path 27.5 dBm Hot Switching 27.5 dBm Temperature Junction, TJ 135°C Storage Range −65°C to +150°C Reflow 260°C Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) RFx Pins 500 V Supply and Digital Control Pins 2000 V 1 For power derating over frequency, see Figure 2 and Figure 3. 2 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 3. Thermal Resistance Package Type θJC Unit CC-20-6, Through Path 240 °C/W POWER DERATING CURVES 2 –14 10k 100G FREQUENCY (Hz) –12 –10 –8 –6 –4 –2 0 100k 1M 10M 100M 1G 10G Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C 36 50 FREQUENCY (GHz) 2 –14 –12 –10 –8 –6 –4 –2 0 37 38 39 40 41 43 45 47 49 42 44 46 48 Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C ESD CAUTION |
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