©2005 National Semiconductor Corporation

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PRELIMINARY

September 2005

CP3SP33 Connectivity Processor with Cache, DSP, and

1.0

General Description

The CP3SP33 connectivity processor combines high per-

formance with the massive integration needed for embed-

ded Bluetooth applications. A powerful RISC core with 4K-

vides high computing bandwidth, DMA-driven hardware

communications peripherals provide high I/O bandwidth,

and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth

Lower Link Controller, Universal Serial Bus (2.0) OTG node

and host controller, dual CAN, dual Microwire/Plus/SPI,

dual ACCESS.bus, quad UART, 10-bit A/D converter, and

telematics/audio codec. Additional on-chip peripherals in-

clude DMA controller, dual CVSD/PCM conversion module,

dog Unit, dual Versatile Timer Unit, dual Multi-Function Tim-

er, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next gen-

eration of embedded Bluetooth products, the CP3SP33 is

backed up by the software resources that designers need

for rapid time-to-market, including an operating system,

Bluetooth protocol stack implementation, peripheral drivers,

reference designs, and an integrated development environ-

ment. Combined with an external program memory and a

Bluetooth radio transceiver such as National’s LMX5252,

the CP3SP33 provides a complete Bluetooth system solu-

tion.

National Semiconductor offers a complete and industry-

proven application development environment for CP3SP33

applications, including the IAR Embedded Workbench,

iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth

Development Board, Bluetooth protocol stack, and applica-

tion examples.

Block Diagram

Bluetooth is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor. Teak is a registered trademark of ParthusCeva, Inc.

TRI-STATE is a registered trademark of National Semiconductor Corporation.