VLMS1300, VLMO1300, VLMY130., VLMG1300, VLMTG1300, VLMB13.0

www.vishay.com

Vishay Semiconductors

Rev. 1.4, 13-Mar-18

11

Document Number: 82437

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

VLMB 130., VLMTG 130.

SOLDERING PROFILE

Fig. 20 - Vishay Lead (Pb)-free Reflow Soldering Profile

(according to J-STD-020C)

BAR CODE PRODUCT LABEL (example only)

A. 2D barcode

B. Vishay part number

C. Quantity

D. PTC = selection code (binning)

E. Code of manufacturing plant

F. Batch = date code: year / week / plant code

G. Region code

H. SL = sales location

I. Terminations finishing

K. Lead (Pb)-free symbol

L. Halogen-free symbol

M. RoHS symbol

Recommended solder

pad footprint

0.8

2.3

0.3

0.3

1.6

Cathode

1.1

Not indicated tolerances ± 0.2

Drawing-No.: 6.541-5094.01-4

Issue: 1; 17.10.11

22617

technical drawings

according to DIN

specifications

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

255

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. Ramp Up 3 °C/s

max. Ramp Down 6 °C/s

255 °C

19470-5

IR Reflow Soldering Profile for lead (Pb)-free Soldering

Preconditioning acc. to JEDEC Level 3

max. 2 cycles allowed

A

B

D

C

E

F

G

H

I

M

L

K