LM350

2

MOTOROLA ANALOG IC DEVICE DATA

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input–Output Voltage Differential

VI–VO

35

Vdc

Power Dissipation

PD

Internally Limited

W

Operating Junction Temperature Range

TJ

– 40 to +125

°C

Storage Temperature Range

Tstg

– 65 to +150

°C

Soldering Lead Temperature (10 seconds)

Tsolder

300

°C

Characteristics

Figure

Symbol

Min

Typ

Max

Unit

Line Regulation (Note 2)

TA = 25°C, 3.0 V ≤ VI–VO ≤ 35 V

1

Regline

–

0.0005

0.03

%/V

Load Regulation (Note 2)

TA = 25°C, 10 mA ≤ Il ≤ 3.0 A

VO ≤ 5.0 V

VO ≥ 5.0 V

2

Regload

–

–

5.0

0.1

25

0.5

mV

% VO

Thermal Regulation, Pulse = 20 ms,

(TA = +25°C)

Regtherm

–

0.002

–

% VO/W

Adjustment Pin Current

3

IAdj

–

50

100

µA

Adjustment Pin Current Change

3.0 V

≤ VI–VO ≤ 35 V

10 mA

≤ IL ≤ 3.0 A, PD ≤ Pmax

1,2

∆IAdj

–

0.2

5.0

µA

Reference Voltage

3.0 V

≤ VI–VO ≤ 35 V

10 mA

≤ IO ≤ 3.0 A, PD ≤ Pmax

3

Vref

1.20

1.25

1.30

V

Line Regulation (Note 2)

3.0 V

≤ VI–VO ≤ 35 V

1

Regline

–

0.02

0.07

%/V

Load Regulation (Note 2)

10 mA

≤ IL ≤ 3.0 A

VO ≤ 5.0 V

VO ≥ 5.0 V

2

Regload

–

–

20

0.3

70

1.5

mV

% VO

Temperature Stability (Tlow ≤ TJ ≤ Thigh)

3

TS

–

1.0

–

% VO

Minimum Load Current to

Maintain Regulation (VI–VO = 35 V)

3

ILmin

–

3.5

10

mA

Maximum Output Current

VI–VO ≤ 10 V, PD ≤ Pmax

VI–VO = 30 V, PD ≤ Pmax, TA = 25°C

3

Imax

3.0

0.25

4.5

1.0

–

–

A

RMS Noise, % of VO

TA= 25°C, 10 Hz ≤ f ≤ 10 kHz

N

–

0.003

–

% VO

Ripple Rejection, VO = 10 V, f = 120 Hz (Note 3)

Without CAdj

CAdj = 10 µF

4

RR

–

66

65

80

–

–

dB

Long Term Stability, TJ = Thigh (Note 4)

TA= 25°C for Endpoint Measurements

3

S

–

0.3

1.0

%/1.0 k

Hrs.

Thermal Resistance, Junction–to–Case

Peak (Note 5)

Average (Note 6)

R

θJC

–

–

2.3

–

–

1.5

°C/W

NOTES: 1. Tlow to Thigh = 0° to +125°C; Pmax = 25 W for LM350T; Tlow to Thigh = – 40° to +125°C; Pmax = 25 W for LM350BT

2. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately.

Pulse testing with low duty cycle is used.

3. CAdj, when used, is connected between the adjustment pin and ground.

4. Since Long–Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability

from lot to lot.

5. Thermal Resistance evaluated measuring the hottest temperature on the die using an infrared scanner. This method of evaluation yields very

accurate thermal resistance values which are conservative when compared to the other measurement techniques.

6. The average die temperature is used to derive the value of thermal resistance junction to case (average).