TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

TEST

PROCEDURE

REQUIREMENT

Resistor

DC resistance

IEC 60115-1 / JIS

C 5201-1 , Clause

4.5

D: ±0.5%,F: ±1%, G: ±5%

Within the specified tolerance

Temperature

Coefficient of

Resistance(T.C.R)

Natural resistance change per change in degree

centigrade.

(ppm/

C)

t2 : 125°C+5°C-1°C

Refer to

“ QUICK REFERENCE DATA “

Short time overload

(S.T.O.L)

IEC60115-1 4.13

5 times of rated power for 5 seconds at room temperature No visible damage

±(1.0%+0.0005Ω)

Resistance to

soldering

heat(R.S.H)

MIL-STD-202G-

method 210F

IEC 60115-1 4.18

Condition B, no pre-heat of samples

Leadfree solder, 260 °C, 10 seconds immersion time

Procedure 2 for SMD: devices fluxed and cleaned with

isopropanol

No visible damage

±(0.5%+0.0005Ω)

Solderability

IPC/JEDEC

J-STD-002B test B

SMD conditions:

1st step: method B, aging 4 hours at 155 °C dry heat

2nd step: leadfree solder bath at 245± 3 °C

Dipping time: 3± 0.5 seconds

good tinning (>95% covered)

no visible damage

Thermal Shock

MIL-STD-202G-

method 107

-55/+125 °C

Note: Number of cycles required is 300. Devices mounted

Maximum transfer time is 20 seconds. Dwell time is 15

minutes. Air – Air

±(1.0%+0.0005Ω)

Endurance

MIL-STD-202G-

method 108

IEC 60115-1 4.25.1

70±2ºC, 1000 hours, loaded with RCWV,,1.5 hours on

and 0.5 hours off

±(1.0%+0.0005Ω)

Bias Humidity

MIL-STD-202

Method 103

1,000 hours at 85ºC/85%R.H. 10% of operating power,

no condensation on the devices, circulating air.

±(1.0%+0.0005Ω)

Bending Strength

IEC60115-1 4.33

Device mounted on PCB test board as described, only 1

board bending required

Bending for

0201: 3mm

0402 and above: 2mm

Holding time: minimum 60 seconds

±(1.0%+0.0005Ω)

High Temperature

Exposure

MIL-STD-202G-

method 108

IEC 60115-1 4.25.3

1,000

hours

at

maximum

operating

temperature

depending on specification, unpowered

No direct impingement of forced air to the parts

Tolerances:

0201/0402 125± 3

0603 and above 170± 3

±(1.0%+0.0005Ω)