FGP30B thru FGP30D

Document Number 88878

10-Aug-05

Vishay Semiconductors

www.vishay.com

1

Pat

ente

d*

DO-204AC (DO-15)

®

* Glass Encapsulation

technique is covered by

Patent No. 3,996,602,

brazed-lead assembly

to Patent No. 3,930,306

Glass Passivated Ultrafast Rectifier

Major Ratings and Characteristics

3.0 A

100 V to 200 V

125 A

35 ns

0.95 V

5.0 µA

175 °C

Features

• Cavity-free glass-passivated junction

• Ideal for automated placement

• Ultrafast reverse recovery time

• Low switching losses, high efficiency

• High forward surge capability

• Meets environmental standard MIL-S-19500

• Solder Dip 260 °C, 40 seconds

Typical Applications

For use in high frequency rectification and freewheel-

ing application in switching mode converters and

inverters for consumer, computer, automotive and

Telecommunication

Mechanical Data

Case: GP20, molded epoxy over glass body

Epoxy meets UL-94V-0 Flammability rating

Terminals: Matte tin plated leads, solderable per

J-STD-002B and JESD22-B102D

E3 suffix for commercial grade, HE3 suffix for high

reliability grade (AEC Q101 qualified)

Polarity: Color band denotes cathode end

Maximum Ratings

Parameter

Symbol

FGP30B

FGP30C

FGP30D

Unit

Maximum repetitive peak reverse voltage

100

150

200

V

Maximum RMS voltage

70

105

140

V

Maximum DC blocking voltage

100

150

200

V

Maximum average forward rectified current

3.0

A

Peak forward surge current 8.3 ms single half sine-wave

superimposed on rated load

125

A

Operating junction and storage temperature range

- 65 to + 175

°C