THS3201

SLOS416A − JUNE 2003 − REVISED JANUARY 2004

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

16.5 V

175 mA

±3 V

Continuous power dissipation

See Dissipation Rating Table

150

°C

Maximum junction temperature, continuous

125

°C

−40

°C to 85°C

−65

°C to 150°C

Lead temperature

1,6 mm (1/16 inch) from case for 10 seconds

300

°C

HBM

3000 V

ESD ratings:

CDM

1500 V

ESD ratings:

MM

100 V

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

 on the underside

of the chip. This acts as a heat sink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure

to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI

technical briefs SLMA002 and SLMA004 for more information

about utilizing the PowerPAD thermally enhanced package.

limited by the constraints of the silicon process.

limited by package constraints. Operation above this temperature

may result in reduced reliability and/or lifetime of the device.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE DISSIPATION RATINGS

PACKAGE

θJC

(

°C/W)

θJA(1)

(

°C/W)

POWER RATING(2)

(TJ = 125°C)

PACKAGE

JC

(

°C/W)

JA

(

°C/W)

TA ≤ 25°C

TA = 85°C

DBV (5)

55

255.4

391 mW

156 mW

D (8)

38.3

97.5

1.02 W

410 mW

DGN (8)

4.7

58.4

1.71 W

685 mW

DGK (8 pin)

54.2

260

385 mW

154 mW

(1) This data was taken using the JEDEC standard High-K test PCB.

(2) Power rating is determined with a junction temperature of 125°C.

This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the

junction temperature at or below 125

°C for best performance and

long term reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Supply voltage

Dual supply

±3.3

±7.5

V

Supply voltage

Single supply

6.6

15

V

−40

85

°C

PACKAGE/ORDERING INFORMATION

PACKAGED DEVICES

TEMPERATURE

PLASTIC SMALL

OUTLINE

(D)(1)

SOT-23(2)

PLASTIC MSOP(1)

POWERPAD

PLASTIC MSOP(1)

OUTLINE

(D)(1)

(DBV)

SYM

(DGN)

SYM

(DGK)

SYM

−40

°C to 85°C

THS3201D

THS3201DBVT

BEO

THS3201DGN

BEN

THS3201DGK

BGP

−40

°C to 85°C

THS3201DR

THS3201DBVR

BEO

THS3201DGNR

BEN

THS3201DGKR

BGP

(1) Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3201DGNR).

(2) Available in tape and reel. The R suffix standard quantity is 3000. The T suffix standard quantity is 250 (e.g. THS3201DBVT).

PIN ASSIGNMENTS

1

2

3

4

8

7

6

5

NC

NC

NC

D, DGN, DGK

TOP VIEW

3

2

4

5

1

VOUT

VS−

IN+

VS+

IN −

SOT−23

TOP VIEW

NC = No Internal Connection

NOTE: If a PowerPAD is used, it is electrically isolated from the active circuitry.