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VSC8504-02 Datasheet(PDF) 125 Page - Microsemi Corporation |
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VSC8504-02 Datasheet(HTML) 125 Page - Microsemi Corporation |
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125 / 131 page ![]() Package Information VMDS-10507 VSC8504-02 Datasheet Revision 4.2 114 Figure 51 • Package Drawing 7.2 Thermal Specifications Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These documents are available on the JEDEC Web site at www.jedec.org. The thermal specifications are modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p 0.20 (4×) X Y 17.00 Pin A1 corner 17.00 1.00 1.00 A 1 2 3 4 5 6 7 9 10 11 12 14 15 16 13 B H J K L M N P R T 8 D C E F G 15.00 15.00 Pin A1 corner 0.25 Z 0.20 Z Z Ø 0.25 Ø 0.10 M MZ X Y Z Seating plane Ø 0.45–0.64 5 4 Top View Bottom View Side View Notes 1. All dimensions and tolerances are in millimeters (mm). 2. Ball diameter is 0.50 mm. 3. Radial true position is represented by typical values. 4. Primary datum Z and seating plane are defined by the spherical crowns of the solder balls. 5. Dimension is measured at the maximum solder ball diameter, parallel to primary datum Z. |
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