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CMD244 Datasheet(PDF) 9 Page - Custom MMIC Design Services, Inc. |
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CMD244 Datasheet(HTML) 9 Page - Custom MMIC Design Services, Inc. |
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9 / 12 page ![]() Custom MMIC 300 Apollo Drive Chelmsford, MA 01824 Phone (978) 467-4290 Fax (978) 467-4294 Visit us online at www.custommmic.com ver 1.5 0419 Die Outline (all dimensions in microns) Mechanical Information CMD244 DC-24 GHz Distributed Driver Amplifier Notes: 1. No connection required for unlabeled pads 2. Backside is RF and DC ground 3. Backside and bond pad metal: Gold 4. Die is 70 microns thick 5. DC bond pads (2, 3, 4, 6, 7, 8) are 75 x 75 microns 6. RF bond pads (1, 5) are 100 x 193 microns 1 5 6 7 3 4 8 716.50 1420.00 1570.00 112.50 242.50 977.00 125.00 1351.50 2057.00 2184.00 2820.00 401.00 2 |
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