High Speed CMOS Logic – 54HC164

 

8-Bit Serial-Input / Parallel-Output Shift Register in bare die form

Rev 1.0

24/11/17

 

 

Output Drive Capability: 10 LSTTL Loads

Low Input Current: 1µA

Outputs directly interface CMOS, NMOS and TTL

Operating Voltage Range: 2V to 6V

 

 

CMOS High Noise Immunity

Function compatible with 54LS164

 

 

Full Military Temperature Range.

 

 

 

 

 

 

Features:

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

The 54HC164 is fabricated using a 2.5µm 5V CMOS

process and has the same high speed performance of

LSTTL combined with CMOS low power consumption. The

device consists of x2 serial data inputs, A and B, provided

so that one input can be used as a data enable. Data is

entered on each rising edge of the clock. A LOW on the

master reset input (CLR) clears the register, forcing all

outputs LOW, independent of other inputs. Inputs are

compatible with standard CMOS outputs and LSTTL via use

of pull-up resistors. All inputs are equipped with protection

circuits against static discharge & transient excess voltage.

 

Description

Die Dimensions in µm (mils)

1060 (41)

 

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

 

 

 

 

 

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

 

 

 

 

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

Die Size (Unsawn)

1060 x 1370

41 x 54

µm

mils

Minimum Bond Pad Size

100 x 100

3.94 x 3.94

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

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