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ABSOLUTE MAXIMUM RATINGS

TPS23750

TPS23770

SLVS590A – JULY 2005 – REVISED AUGUST 2005

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

UVLO THRESHOLDS

MARKING

TYPE

LOW

HIGH

TSSOP-20 PowerPAD™

Standard

30.5 V

39.3 V

TPS23750PWP

TPS23750

–40

°C to 85°C

Legacy

30.5 V

35.1 V

TPS23770PWP

TPS23770

(1)

Add an R suffix to the device type for tape and reel.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

over operating free-air temperature range and with respect to V

(1)

UNIT

RSN, COM, RTN, SEN

–0.7 V to 100 V

Input voltage range

AUX, VDD, DET, SENP

–0.3 V to 100 V

–0.3 V to 6.5 V

Input voltage range

[GATE or AUX] to COM

–0.3 V to 20 V

Input voltage range

[RSN to RTN] and [COM to RTN]

–0.3 V to 0.3 V

SENP to SEN

–0.3 V to 100 V

CLASS

–0.3 V to 12 V

Sourcing current

AUX

Internally limited

Sourcing current

Internally limited

Sourcing or sinking current, COMP

Internally limited

Average sourcing or sinking current, GATE

HBM ESD rating

2 kV

8 kV / 15 kV

Continuous total power dissipation

See Dissipation Rating Table

Maximum operating junction temperature

Internally limited

Storage temperature range

–65

°C to 150°C

Lead temperature 1.6mm (1/16-inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

(4)

Surges applied to RJ-45 of Figure 40 between pins of RJ-45, and between pins and output voltage rails per EN61000-4-2, 1999 with no

device failure.

2